2355
Adherent Electroless Copper Deposition Using Inexpensive Sn/Ag Catalyst On Non-Roughened Epoxy Laminate Substrates

Thursday, October 31, 2013: 10:20
Union Square 11, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Erdal Uzunlar, Ph.D. Candidate , Georgia Institute of Technology, Atlanta, GA
Zachary Wilson, BS , Georgia Institute of Technology
Paul A Kohl, Ph.D. , Georgia Institute of Technology, Atlanta, GA

Abstract:

See more of: Thin Films
See more of: F4: Fundamentals of Electrochemical Growth - From UPD to Microstructures 3
See more of: Electrochemical/Chemical Deposition and Etching
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