2014
Epitaxial Transfer Printing of Compound Semiconductor Nanomembranes and Device Applications

Tuesday, 7 October 2014: 14:00
Expo Center, 1st Floor, Universal 19 (Moon Palace Resort)
D. S. Um, Y. Lee, H. Lee, S. Lim, and H. Ko (Ulsan National Institute of Science and Technology)
Recently, the heterogeneous integration of compound semiconductors on arbitrary substrates has attracted great interests due to their promising applications in high-performance transistors, optoelectronics, and spintronics on flexible and low-cost substrates. The heterogeneous integration of compound semiconductors on arbitrary substrates provides combined advantages of the high performance of compound semiconductors and the well-established, low-cost processing of Si, glass, and flexible substrates. However, the development of simple and efficient strategies for the heterogeneous integration of compound semiconductors on arbitrary substrates still remains a big challenge. Here, we introduce an epitaxial transfer method for the heterogeneous integration of ultrathin III-V nanomembranes on arbitrary substrates. For efficient transfer printing process, we report the fabrication of bio-inspired smart adhesive pads based on microstructured elastomers coated with thermo-responsive polymers, where the adhesion properties can be thermally controlled. In addition, we demonstrate that high-quality InAs nanoribbons are successfully integrated on Si substrates for the fabrication of high-performance field-effect transistors. Furthermore, we demonstrate heterogeneously integration of various types of compound semiconductors on arbitrary substrates for applications in spintronics and photodetectors on heterogeneous substrates.