2014
Epitaxial Transfer Printing of Compound Semiconductor Nanomembranes and Device Applications
Epitaxial Transfer Printing of Compound Semiconductor Nanomembranes and Device Applications
Tuesday, 7 October 2014: 14:00
Expo Center, 1st Floor, Universal 19 (Moon Palace Resort)
Recently, the heterogeneous integration of compound semiconductors on arbitrary substrates has attracted great interests due to their promising applications in high-performance transistors, optoelectronics, and spintronics on flexible and low-cost substrates. The heterogeneous integration of compound semiconductors on arbitrary substrates provides combined advantages of the high performance of compound semiconductors and the well-established, low-cost processing of Si, glass, and flexible substrates. However, the development of simple and efficient strategies for the heterogeneous integration of compound semiconductors on arbitrary substrates still remains a big challenge. Here, we introduce an epitaxial transfer method for the heterogeneous integration of ultrathin III-V nanomembranes on arbitrary substrates. For efficient transfer printing process, we report the fabrication of bio-inspired smart adhesive pads based on microstructured elastomers coated with thermo-responsive polymers, where the adhesion properties can be thermally controlled. In addition, we demonstrate that high-quality InAs nanoribbons are successfully integrated on Si substrates for the fabrication of high-performance field-effect transistors. Furthermore, we demonstrate heterogeneously integration of various types of compound semiconductors on arbitrary substrates for applications in spintronics and photodetectors on heterogeneous substrates.