Additive Effects on Surface Dynamics and Growth at the Metal-Electrolyte Interface

Understanding of electrodeposition on nanometer length scales becomes more and more important, especially in the context of microchip metallization. Although additives are indispensable for modern plating technology, the molecular scale mechanisms by which they modify growth processes at the solid-liquid interface are often unclear. In this talk I will discuss fundamental studies by state-of the-art in situ scanning probe microscopy and synchrotron-based X-ray scattering techniques, focusing on the effect of chloride adsorbates and simple organic surfactants on Au and Cu electrodeposition. These methods allow direct quantitative measurements of the surface dynamics and interaction of chemisorbed species as well as time-resolved operando studies of the structural evolution of the deposit during growth. In particular, these studies reveal that the surface transport processes and the resulting deposit morphology are strongly affected by the potential and coadsorbates, leading to pronounced and partially unexpected growth behavior.