1320
Cleaning Solution Effect on Electrical and Reliability Properties of Dense and Porous Low Dielectric Constant Materials

Wednesday, 27 May 2015
Salon C (Hilton Chicago)

ABSTRACT WITHDRAWN

The effects of different cleaning solutions and various immersion times on the electrical and reliability characteristics of the low-k dielectrics are investigated in this study. After immersing in a wet cleaning solution, both dense and porous low-k dielectrics are needed a post-baking process to remove the physically-adsorbed water. The experimental results indicate that the acid HF solution and basic NH4OH solution have negative impact on low-k dielectrics. Moreover, the acid HF solution causes the low-k dielectrics to be modified and a longer immersion time have larger impact. The formation of chemically-adsorbed water and the increased pore size or porosity in the low-k dielectrics with HF solution immersion were observed. These phenomena become more obviously in the porous low-k dielectrics with a longer immersion time. Except the positive benefit in the reduction of the dielectric constant, these changes cause the degradation in electrical and reliability performance for low-k dielectrics.