Flexible Devices

Monday, 25 May 2015: 14:00-15:50
PDR 5 (Hilton Chicago)
Chairs:
Luca Magagnin , Andrew Hoff and Paula Cojocaru
14:00
1141
Electroless Plating of PLA and PETG for 3D Printed Flexible Substrates
R. Bernasconi, G. Natale, M. Levi, and L. Magagnin (Politecnico di Milano)
14:20
1142
"Nano Necklace" Formed by Electroless Deposition of Metal on Polymer Nanofiber for Flexible Transparent Conducting Films
S. Shiratori (Graduate School of Science &Engineering, Keio University), I. Takenaka, K. Kyung (Graduate School of Science & Engineering, Keio University), R. Bernasconi (Politecnico di Milano), A. Testa (Politechnoco di Milano), and L. Magagnin (Politecnico di Milano)
14:50
1143
Spalling of a Single Crystalline Silicon Layer By Electroless/Electrodeposit-Assisted Stripping(EAS) Process for Flexible Silicon Devices
C. Yang (Hanyang University), S. Yu (Hanyang university), and B. Yoo (Hanyang University)
15:10
1144
(Invited) Solution-Processing Routes to Conductive Ultrathin Films of Ruthenium Dioxide...on Any Substrate
D. R. Rolison (U.S. Naval Research Laboratory), I. R. Pala, M. D. Donakowski (NRC Postdoctoral Associate, U.S. Naval Research Laboratory), C. N. Chervin, J. W. Long, R. Stroud, T. Brintlinger, and X. Liu (U.S. Naval Research Laboratory)
15:50
Concluding Remarks
See more of: E01: Metallization of Flexible Electronics
See more of: Electrochemical/Electroless Deposition
<< Previous Session | Next Session >>