FET devices are extensively used for sensors, including gas sensors and biosensors. In contrast to traditional resistive devices, FET has transconductance gain, which can significantly improve the S/N ratio. Recently, more and more applications in biosensors combine microfluidic channels and the FET system. In FET-based biosensors, the wafer manufacturing process always requires a lot of cost, and most of the chip area is used for metal lines as interconnect. Miniaturized chip plays a key role in reducing the manufacturing cost. However, simultaneously integrating the sensor chip and microfluidic channels on one chip is challenging. In this study, a novel and robust packaging method has been developed, to effectively reduce the size of the sensor chip and thereby the cost. 1 mm x 1 mm FET sensor chip has been fabricated and embedded in epoxy. Photolithography and metal deposition were done followed by lift-off process for metal interconnect. The FET-embedded chip was passivated and covered by the microfluidic channel made of PDMS. Figure 1 shows the schematic of the system and the final package size is 1cm x 1cm. Electrical measurement is also proceeded with liquid sample to confirm the usability.