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Characterization and Metrology of Gold and Copper Electroplated Stylus Ion Traps

Wednesday, 1 June 2016: 10:20
Aqua 307 (Hilton San Diego Bayfront)
C. L. Arrington, A. E. Hollowell, J. R. Pillars (Sandia National Laboratories), V. Singh (LSU Center for Advanced Microstructures and Devices CAMD), P. Finnegan, and C. R. St. John (Sandia National Laboratories)
Electrochemical fabrication offers unique advantages for nano/microfabrication of 2D and 3D structures.  Precise control of deposition molds and thicknesses allows significant challenges to be solved through electrodeposition that are beyond the capabilities of standard silicon methods and conventional machining techniques. One unique application is the study of trapped ions enabling enhanced measurement techniques and reduction of anomalous motional heating 1. The main goal is to correlate the physical features with electric field noise, which can be sensitively measured with the ions. Previous two layer ion taps were created using electroformed gold into high aspect ratio molds, here we further investigate effects of chemistry make-up, applied current density, and pulse plating of gold and copper electrochemical deposition. The effects will then be characterized using scanning electron microscopy, profilometry, energy dispersive spectroscopy, x-ray diffraction, and electron backscatter diffraction to characterize feature height, feature dimensions, surface roughness, stoichiometry, crystal structure, and crystallite size. 

1              C. L. Arrington, K. S. McKay, E. D. Baca, J. J. Coleman, Y. Colombe, P. Finnegan, D. A. Hite, A. E. Hollowell, R. Jordens, J. D. Jost, D. Leibfried, A. M. Rowen, U. Warring, M. Weides, A. C. Wilson, D. J. Wineland, and D. P. Pappas, 'Micro-Fabricated Stylus Ion Trap', Review of Scientific Instruments, 84 (2013).

Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-AC04-94AL85000. SAND2015‑10657A