A model based in COMSOL Multiphysics (a finite element analysis software) consisting of a specially designed electrorefining cell was developed to simulate copper electrorefining. This cell has its inlet on the side wall near the cell top and its outlet on the opposite side wall near the cell bottom. The electrolyte enters from the inlet, flows directly into the gap between electrodes, and exits the cell from the bottom outlet. Unlike the flow field in conventional electrorefining cells that have inlets near the cell bottom and outlets near the cell top, the natural convection between electrodes in this cell can be suppressed by the inlet flow, which leads to concurrent downward flows along both the anode and the cathode. Copper concentration profile and fluid density profile were acquired as electrochemical simulation results. Electrolyte flow velocity field, slime particle trajectory, and slime particle distribution were obtained as fluid flow and particle transport simulation results. Features of the copper concentration profile, the electrolyte flow field, and the slime particle transport are discussed. The simulation results of this cell were compared with those of a conventional cell, and some advantages of this cell can be found: copper ions in the cell are more uniformly distributed between electrodes by the strong forced convection; electrode reactions can reach steady state at higher current densities and lower electrolyte copper concentrations; slime particles are more likely to settle to the cell bottom without affecting the cathode purity.