In order to enhance activity and durability, and minimize the use of expensive catalytic materials, deposition of ultrathin metal/alloy films with controllable thickness and composition has attracted broad attention in last decades. Electrochemical atomic layer deposition (E-ALD) approaches for the growth of single metal films such as Pt and Pd have been developed by our group based on surface-limited redox replacement (SLRR) in one cell configuration.4,5The application of SLRR for deposition of alloy films has been taken as challenge and thoroughly studied in this report. CuxAu(1–x)bimetallic ultrathin-film catalysts have been synthesized using E-ALD by SLRR of Pb underpotentially deposited layer.6 The composition of synthesized alloy ultra-thin film could be controlled by the ratio of [Cu2+] ions and [AuCl4–] complex in the deposition solution along with the application of specifically designed routine facilitating the administration of SLRR cycles. The alloy film composition has been determined by X-ray photoelectron spectroscopy and indirectly estimated by anodic stripping voltammetry.
The nitrate electroreduction activity and durability of CuxAu(1–x)thin films, Cu thin film, and bulk Cu have been studied by one- and multiple-cycle voltammetry. The synthesized CuxAu(1–x)thin films feature up to two times higher nitrate electroreduction activity in acidic solution compared to bulk and thin-film Cu counterparts. Highest activity has been measured with a Cu0.70Au0.30alloy catalyst. Durability tests have demonstrated that Cu thin films undergo rapid passivation losing 65% of its peak activity for up to 100 cycles, whereas Cu0.70Au0.30catalysts developed in this study lose about 40% of their top performance. The significantly better durability of alloy films can be attributed to effective resistance to poisoning and/or minimized passivation of Cu active centers. It has been also found that both CuxAu(1–x)and pure Cu thin films show best electroreduction activity at lowest pH.
References
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