Chemical mechanical planarization (CMP) is a critical process step used in the fabrication of integrated circuits (ICs) and has ultimately led to the extension of Moore’s Law. Through a synergistic balance of a colloidal dispersion and mechanical downforce, excess topography is removed to achieve angstrom-level uniformity. Upon the completion of the CMP process, removal of unwanted particle residue/organic contaminants is achieved using oxidation/reduction reactions, etching, or encapsulation chemistry coupled with ultrasonic methods or polyvinyl alcohol (PVA) brush cleaning. The nature of the current cleaning techniques has been known to provide insufficient cleaning capacity for next generation devices. This work focuses on employing supramolecular chemistries as a means to improve overall post-STI CMP cleaning efficiency under low mechanical stress conditions, ultimately reducing defectivity. More specifically, the development of a supramolecular brush comprised of biomimetic polymers, such as β-cyclodextrin, was synthesized with excellent pore size tunability, which in turn is correlated to swellability, durability, and efficiency of particle removal.