The developed process allows the fabrication of half-structured MEAs with different three-dimensional nanostructure shapes, geometries and pitch lengths and is mainly based on thermal nanoimprint lithography (NIL), gold electroplating and microstructuring techniques. During thermal NIL a customized, nanostructured master mold is pressed into a polymer resist of a wafer substrate, thus creating a negative copy of the master´s nanostructures. The subsequent electroplating step can be adjusted in a way, that it fills or overgrows the NIL templates, thereby creating different shapes. Photolithography, chemical vapor deposition and etching steps are used to fabricate the overall MEA geometry.
Cyclic voltammetry as well as electrochemical impedance spectroscopy have been applied to characterize the effect of different nanostructure geometries on charge transfer, double-layer capacitance and impedance of the MEA electrodes. Compared to unstructured electrodes, charge transfer and double-layer capacitance of the nanostructured electrodes are increased, whereas the impedance of the nanostructured electrodes are decreased. These results can directly be related to an increase of the electrochemically active surface area and vary with the investigated nanostructure layout.
To examine the effect of the nanostructures on cell-electrode coupling in detail and to quantify cell adhesion, impedance sensing at a fixed frequency of 1 kHz has been performed using the impedance-stable human embryonic kidney cell line HEK 293. Impedance values have been measured with and without cells. Due to the chip layout where non- and nanostructured electrodes have been included on the chip, the relative change of the impedance values could directly be correlated with cell-electrode adhesion. By this, a significant increase or decrease of cell-electrode coupling depending on the nanostructure layout could be demonstrated. For verification, action potential recordings with neural stem cells of the subventricular zone of postnatal mice have been performed, showing a distinct increase of the recorded signal amplitudes of the nanostructured electrodes compared to unstructured electrodes of the same chip. The latter might be correlated to an engulfment process of the cells.
Figure: Left: Impedance measurement to quantify cell-electrode adhesion. Right: SEM picture of attached SVZ cells on top of overgrown pillar structures (Inset: Magnification, scale bar: 2 µm).
