(Invited) The Glass Transition of Perfluorosulfonic Acid Membranes in Consideration of Thermal Processing-Property Relationships

Wednesday, 16 October 2019: 14:00
Galleria 7 (The Hilton Atlanta)
R. B. Moore, C. M. Orsino, M. H. Novy (Virginia Tech), D. Duchesne, G. Dahlke, and L. Chen (3M Corporation)
Perfluorosulfonic acid ionomers (PFSAs) are the benchmark materials used as proton-exchange membranes (PEMs) in fuel cells. Conventional PFSA membranes have a chemical structure consisting of a PTFE backbone with randomly distributed perfluoroether side chains that terminate with a sulfonic acid group. These polar -SO3H groups, distributed within a matrix of non-polar PTFE segments, tend to aggregate forming a complex nanostructured network of hydrophilic domains. Further percolation of these domains (generally observed with increasing water content) provides pathways for efficient transport of protons (or other ions) and water in a variety of membrane-based electrochemical energy conversion and storage applications. To enhance or optimize the transport properties of a given PFSA, a variety of solvent casting and post-processing thermal treatments have been developed to facilitate molecular mobility during morphological development. In this presentation, we will focus on molecular-level considerations of the glass transition, Tg, of PFSAs with respect to thermal drying and annealing protocols used in conventional PFSA membrane processing. Using dynamic mechanical analysis (DMA), we have previously assigned the true Tg of H+-form Nafion® to be associated with a weak β-relaxation observed near -20 °C. Recently, we have found that the β-relaxations in other PFSAs (e.g., 3M PFSA and Solvay’s Aquivion®) can also be assigned to the glass transitions of these polymers. Nevertheless, the β-relaxations of all these PFSAs are weak in comparison to the dominant α-relaxation, associated with a transition from a physically crosslinked, H-bonded network to a dynamic network that allows for significant reorganization of the polar functionalities during thermal processing.