Based on these premises, the design of an organic solution, overcoming the intrinsic limitation water-based ones [4-5], is proposed and successfully employed for the electrodeposition of copper onto zinc. Copper displacement reaction is assessed and investigated, paying attention to how the metal salt concentration and the introduction of a copper complexing agent affected the reactivity towards zinc. Once minimized displacement reaction and electrochemically characterized the electrolyte through cyclic voltammetry, the galvanostatic deposition was carried out to obtain the desired film thickness and morphology. The precursor stack (Mo/Zn/Cu/Sn) was then soft annealed at 300 °C and converted into CZTS kesterite through reactive annealing in a sulfur atmosphere at 560-580 °C. The film was characterized by means of XRD, SEM and Raman spectroscopy. At last, the CdS buffer layer and the Pt catalyst was deposited in the view of photoelectrochemical investigation (100 mW/cm2 AM 1.5 G) to assess the semiconductor photoactivity
References
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