D01 - Metrology for Emerging Processes and Materials

Tuesday, 15 October 2019: 15:30-16:50
Room 208 (The Hilton Atlanta)
Chairs:
Yaw S. Obeng , Kalpathy B. Sundaram , Vimal H. Chaitanya and Daniel V. Esposito
15:30
Application of Broadband Microwave Metrology to Emerging Integrated Circuit Device Reliability Analyses
Y. S. Obeng (National Institute of Standards and Technology (NIST)) and P. K. Amoah (NIST)
16:10
Estimation of through-Plastic Via (TPV) Filling through Computed Tomography for Dielectrics and Conductive Inks in Flexible Printed Electronics
K. Sondhi (University of Florida), S. G. R. Avuthu (Jabil Circuits Inc.), H. Fan, and T. Nishida (University of Florida)
16:30
Appraising the Extensibility of Optics-Based Metrology for Emerging Materials
B. M. Barnes, M. A. Henn, H. Zhou, and R. M. Silver (National Institute of Standards and Technology)
See more of: D01: Semiconductors, Dielectrics, and Metals for Nanoelectronics 17
See more of: Dielectric Science and Materials
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