Additive processing like fused deposition modeling (FDM) can be used for customized products or prototypes. Due to the layer-by-layer structure it is possible to work flexibly and efficiently in geometry. In the electronics industry geometrically demanding circuit carriers can be built in relatively short times, but the processes are somewhat inflexible and take a series of processing steps. Circuit boards are made from layers of fiber-reinforced plastics and then joined by pressing. Vertical interconnects are made by copper plating. Finally, electronic components added via a soldering process.

With FDM it is possible to work flexibly with regard to geometry, printing different materials, and a large selection of filaments is given. For a circuit board, one needs at least two filament materials (one insulator, one electronic conductor) to realize conducting lines.

In this work we use FDM with different polymers for printing the substrate plate and conductor track structures in a single process. Some of the filaments are electrically conductive and can be used as conducting path structures. However, the electrical resistance of these filaments is significantly lower than conventional copper tracks. Especially for higher currents, chemical metallization of the polymer tracks with copper and tin is necessary. In the presentation we will discuss the preliminaries for achieving selective electroless metallization on selected FDM filament materials.