Wednesday, 1 June 2022: 14:00-15:20
West Meeting Room 113 (Vancouver Convention Center)
Chairs:
Despina Davis
,
Natasa Vasiljevic
and
Adriana Ispas
14:40
Electrohydrodynamic Redox 3D Printing: Confined Electroplating of Alloys for Additive Manufacturing at the Submicron Scale
M. Nydegger, N. Porenta, M. Menétrey (Laboratory for Nanometallurgy, ETH Zürich, Switzerland), S. Hammadi (Ångström Laboratory, Uppsala University, Sweden, Laboratory for Nanometallurgy, ETH Zürich, Switzerland), A. Reiser (Laboratory for Nanometallurgy, ETH Zürich, Switzerland, Department of Materials Science and Engineering, MIT, USA), and R. Spolenak (Laboratory for Nanometallurgy, ETH Zürich, Switzerland)
15:00
(Digital Presentation) Electrochemical Deposition of Sn-Cu Alloys for Applications in 3D Stacking in Microelectronics Industry
A. Radisic, F. Inoue, Z. El-Mekki, H. Struyf, L. Hou, J. Derakhshandeh, E. Beyne (IMEC), C. H. Hsia, I. Chang, E. Kuttner, A. Fluegel, and M. Arnold (BASF)