E02 - Surfactant and Additive Effects

Wednesday, 1 June 2022: 13:20-18:00
West Meeting Room 114 (Vancouver Convention Center)
Chairs:
Thomas Moffat and Timo Jacob
13:20
1178
Bottom-up Gold Filling for Manufacture of X-Ray Gratings: To What Limit?
D. Josell and T. Moffat (National Institute of Standards and Technology)
13:40
1179
Atomic-Scale Friction Study: Underpotential Deposition (UPD) of Silver on I-Modified Au(111) in Aprotic Electrolyte
I. Park and H. Baltruschat (University of Bonn)
14:00
1180
Differences in Electrodeposition of Cu Onto Au(111) from Deep Eutectic Solvents of Varying Composition
T. Geng (University of Ulm), S. J. Zeller (University of Ulm, Helmholtz-Institute Ulm), M. U. Ceblin, L. A. Kibler, and T. Jacob (University of Ulm)
14:20
1181
Adsorption-Mediated Electrochemical Atomic Layer Deposition of Gold
D. R. N. Wasalathanthri, Y. Gong (Case Western Reserve University), M. M. Biener, A. N. Ivanovskaya, N. A. Dudukovic (Lawrence Livermore National Laboratory), and R. Akolkar (Case Western Reserve University)
14:40
1182
Single-Crystal Electrochemistry Uncovers the Role of Citrate in the Anisotropic Growth of Ag Nanostructures
H. Xu and B. Wiley (Duke University)
15:00
1183
Diversity Matters: Influence of Surface Heterogeneities in the Electrochemical Nucleation and Dissolution of Au Nanoparticles
M. Bernal Lopez, D. Torres (Université Libre de Bruxelles), S. Semsari Parapari (Jožef Stefan Institute), M. Čeh (Jožef Stefan Institute, Center za elektronsko mikroskopijo in mikroanalizo), K. Žužek Rožman, S. Šturm (Jožef Stefan Institute), and J. Ustarroz (Vrije Universiteit Brussel, Universite Libre de Bruxelles)
15:20
1184
Structure Specific Adsorbate Interactions at Electrodepositing Cu Interfaces
D. Raciti, A. Hight Walker, and T. Moffat (National Institute of Standards and Technology)
15:40
Break
16:00
1185
Influence of 1,1-Dimethylpropargylamine on Nickel Electroplating
A. Moazezi, U. Schmidt, A. Ispas, and A. Bund (Technische Universität Ilmenau)
16:20
1186
Nucleation and Growth of Copper on Cobalt in Advanced Interconnect Metallization
Y. Liu, L. Brogan, W. J. Zhou, M. A. Rigsby, M. M. Huie, E. C. Opocensky, T. A. Spurlin, A. Kolics, and J. D. Reid (Lam Research Corporation)
16:40
1187
Minimum Thickness of Continuous Cu Layers on Mo from Fluoride Free Electrolytes
K. Ahmadi, P. Quaye (University of Houston), N. Dole, A. Joi (Lam Research Corporation), and S. Brankovic (University of Houston)
17:00
1188
Lifting Polyether Suppression during Cu Electrodeposition
T. Moffat, T. M. Braun, D. Raciti (National Institute of Standards and Technology), G. K. Liu (Xiamen University), L. Y. Ou Yang (TSMC), W. Osborn (NIST), L. J. Richter, A. Hight Walker, and D. Josell (National Institute of Standards and Technology)
17:20
1189
(Digital Presentation) On Epitaxial Electrodeposition of Co, Ru and Cu for Interconnect Applications
K. Katayun Barmak (Columbia University)
17:40
1190
(Digital Presentation) Operando Laser Scattering- and Inverted RDE-Based Approaches for the Development of Additive-Assisted Electrodeposited Co Interconnects
P. Moreno Garcia (University of Bern), V. Grozovski (University of Tartu), M. D. J. Gálvez-Vázquez (University of Bern), A. Fluegel (BASF SE Ludwigshafen), S. Kitayaporn (BASF Corporation, Global Business Unit Electronic Materials), S. Vesztergom (Eötvös Loránd University), and P. Broekmann (University of Bern)
See more of: E02: Nucleation and Growth: Measurements, Processes, and Materials
See more of: Electrochemical/Electroless Deposition
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