In particular, transition metal phosphides (TMPs) such as Ni-P are receiving much attention due to its remarkable catalytic performance approaching that of Pt-based one. [1]. Specifically, in Ni-P, the electrons are transferred from Ni to P due to the difference in electronegativity, so that the energy of the HER intermediate can be controlled to have the optimal activity. Moreover, the binding site of Ni-P acts as a new active site, increasing the performance more. Nevertheless, the major issue to be solved for commercialization of Ni-P is the low stability due to the dissolution of Ni, especially in acidic media where its corrosion potential is lower than HER. Specially, the Ni dissolution is most severe in the isolated Ni phases, which is relatively unbounded with P [2].
In this context, we suggest a stability enhancement method of NiP by adopting the metallic stabilizer. Specifically, We prepared NiP-Cu by substituting Cu into the isolated Ni sites (Fig. 1a). We believed that the higher reduction potential of Cu might increase the overall corrosion resistance of the NiP-based material. As a result (Fig1. c), the corrosion potential of NiP-Cu was measured to be -333 mV, which is 12 mV higher than the pristine Ni-P. Also, in the accelerated degradation test (ADT) including potential sweep, the NiP-Cu showed three times lower degradation rate (3 mV/h)than NiP (12 mV/h), as shown in Fig1c-d.
References
[1] P. Liu, and J. Rodriquez, J. Am. Chem. Soc.,2005, 127, 42, 14871-14878
[2] A. Kucernak, and V. Sundaram, J. Mater. Chem. A, 2014, 2, 17435-17445.