The electroplating of active metal in water is extremely challenging. The oxidative reactivity of active metals such as aluminum and zirconium metal leads to a very negative reduction potential. It makes the reduction in the presence of water impossible. Current active metal deposition is performed under inert conditions.

We have utilized a unique ligation approach; we can create aluminum species that remain stable in water and lower the reduction potential for aluminum by 0.5V. This lowering of reduction potential allows us to electrochemically reduce aluminum in water and compete with hydrogen evolution. With this platform we are able to deposit highly adherent layers of aluminum oxide layers on metal surfaces. The aluminum oxide layers are thin, coherent and highly adherent coatings. This aluminum oxide layer can then be chemically adapted to achieve previously inaccessible surface properties. For example, the coating can be made hydrophobic, highly adherent to different polymer coatings and a great tie layer to grow ceramic coatings.

We will be discussing the initial theory in reduction potential and then sharing the results of our work.