In this work, the electrodeposition and stripping characteristics of metallic Na in the electrolyte of 1 mol L-1 NaClO4/EC+DMC (1:1 vol. %) were studied and the deposition-stripping behavior of Na+ on Cu and Sn substrates were compared. The deposition-stripping cycling performances of Na on the substrates were studied through galvanostatic charge-discharge method and cyclic voltammetry. The morphologies of the substrates before and after Na+ deposition were investigated through digital video microscopy. The kinetics of the Na+ electrodeposition on the different substrates was studied through galvanostatic pulse method. The solid electrolyte interface films of Na+ deposits on the substrates were characterized via electrochemical impedance spectroscopy. The results indicate that the nature of the substrate can significantly affect the electrodeposition characteristics of Na+. The high reactivity of metallic sodium with the organic electrolyte solvents and the dendrite formation during metallic Na deposition are even more problematic than metallic Li anodes. Sn is a more suitable substrate than Cu for Na+ electrodeposition due to the formation of Na—Sn alloy during the deposition of Na+.
References
[1] M. D. Slater, D. Kim, E. Lee, C. S. Johnson, Adv. Funct. Mater., 2013, 23, 947.
[2] S. Komaba, W. Murata, T. Ishikawa, N. Yabuuchi, T. Ozeki, T. Nakayama, A. Ogata, K. Gotoh, K. Fujiwara, Adv. Funct. Mater., 2011, 21, 3859.
[3] S. W. Kim, D. H. Seo, X. H. Ma, G. Ceder, K. Kang, Adv. Energy Mater., 2012, 2, 710.
Relating topic:
New Na based Electrodes