976
Environmental Effects on Peel Strength between Copper and Polyimide Films

Tuesday, May 14, 2013: 15:20
Willow Ballroom West, Mezzanine Level (Sheraton)
Ho-Nyun Lee , Korea Institute of Industrial Technology, Incheon, South Korea
Yoon Sung Han , Korea Institute of Industrial Technology
Jang-hun Lee , Korea Institute of Industrial Technology
Jin-Young Hur , Korea Institute of Industrial Technology
Hong-Kee Lee , Korea Institute of Industrial Technology, Incheon, South Korea

Abstract:

See more of: Green Electrodeposition
See more of: F1: Green Electrodeposition 3
See more of: Electrochemical/Chemical Deposition and Etching
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