Abstract: Study On Fundamental Aspects of Seedless Copper Electrodeposition On Diffusion Barriers in an Additive-Free Electrolyte for Silicon-Based Integrated Devices (223rd ECS Meeting (May 12-17, 2013))

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Study On Fundamental Aspects of Seedless Copper Electrodeposition On Diffusion Barriers in an Additive-Free Electrolyte for Silicon-Based Integrated Devices

Wednesday, May 15, 2013: 14:40

York, Mezzanine Level (Sheraton)

Sunjung Kim, Ph.D. , University of Ulsan, Ulsan, South Korea

Byoungyong Im , University of Ulsan

Soo-Hyun Kim, Ph.D. , Yeungnam University

Abstract:

G3-1034 (1839.5KB) - Abstract Text