1034
Study On Fundamental Aspects of Seedless Copper Electrodeposition On Diffusion Barriers in an Additive-Free Electrolyte for Silicon-Based Integrated Devices

Wednesday, May 15, 2013: 14:40
York, Mezzanine Level (Sheraton)
Sunjung Kim, Ph.D. , University of Ulsan, Ulsan, South Korea
Byoungyong Im , University of Ulsan
Soo-Hyun Kim, Ph.D. , Yeungnam University

Abstract:

  • G3-1034 (1839.5KB) - Abstract Text