2395
Cu Electroless Deposition By Using Cu Nanoparticles As Catalysts for a Printed Circuit Board Metallization

Tuesday, October 29, 2013: 17:10
Union Square 23/24, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Yi-Chun Chung, Master , Department of Chemical Engineering, Taichung, Taiwan
Wei-Ping Dow , National Chung Hsing University

Abstract:

See more of: Novel Nano-materials via Electrochemical Routes
See more of: F5: Emerging Opportunities in Electrochemical Deposition for Nanofabrication
See more of: Electrochemical/Chemical Deposition and Etching
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