2398
Towards An Atomistic Understanding of the Activation of Plating Additives At the Copper/Electrolyte Interface

Wednesday, October 30, 2013: 08:00
Union Square 23/24, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Hai Nguyen , Freiestrasse 3, University of Bern, Bern, Switzerland
Thi Mien Trung Huynh , University of Bern
Alexander Flügel , BASF SE
Marco Arnold , BASF SE
Dieter Mayer , BASF SE
Peter Broekmann , University of Bern, Bern, Switzerland

Abstract:

See more of: Probing Electrochemical Processes
See more of: F5: Emerging Opportunities in Electrochemical Deposition for Nanofabrication
See more of: Electrochemical/Chemical Deposition and Etching
Previous Abstract | Next Abstract >>