Probing Electrochemical Processes

Wednesday, October 30, 2013: 08:00-09:40
Union Square 23/24, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Thomas P. Moffat and M. Buck
Towards An Atomistic Understanding of the Activation of Plating Additives At the Copper/Electrolyte Interface
Hai Nguyen, University of Bern; Thi Mien Trung Huynh, University of Bern; Alexander Flügel, BASF SE; Marco Arnold, BASF SE; Dieter Mayer, BASF SE; Peter Broekmann, University of Bern
Using Vibrational Spectroscopy and Electrochemical Stress Measurements to Interrogate Metal Electrode Surfaces
Andrew Gewirth, University of Illinois, Urbana-Champaign; Justin Oberst, University of Illinois; Kevin Schmitt, University of Illinois; Hadi Tavassol, University of Illinois, Urbana-Champaign
Optimization of Leveler Concentrations in Copper Via Filling for Deduction of Contamination
Jae-Ho Lee, Ph. D., Hongik University; Ki-Tae Kim, BS, Hongik University
Effects of Anodizing Parameters On the Formation of Titanium Dioxide Nanotubes
Zeynep Bolukoglu, Middle East Technical University; Ishak Karakaya, Prof. Dr., Middle East Technical University; Metehan Erdogan, Ph.D., Yildirim Beyazit University