Study on the Interface Instability of Copper-Nickel Multi-Layer with Nano-Thickenss Formed By Pulse Reverse Plating

Thin copper-nickel multi-layers with nano-thickness were prepared by pulse electro-plating. Transmission electron microscopy (TEM) revealed that the average thickness of the copper and nickel layers were about 14 and 16 nm. Annealing of the multi-layers at the temperature range of 300 and 600^oC resulted in producing interface grooving. Small angle neutron scattering (SANS) well proved  non-destructively that the interface grooving completely occurred above 500^oC. The interface energy of the copper-nickel layer with nano-thickness will be determined by atomic force microscopy.