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Comparison of O2 Plasma Treatment on Porous Low Dielectric Constant Material in Sidewall and Bottom of Trench Structure
Comparison of O2 Plasma Treatment on Porous Low Dielectric Constant Material in Sidewall and Bottom of Trench Structure
Wednesday, 8 October 2014
Expo Center, 1st Floor, Center and Right Foyers (Moon Palace Resort)
The degradation induced by oxygen (O2) plasma irradiation to the porous low dielectric constant materials (low-k; k=2.5) has been investigated in this study. The impact in the sidewall and bottom of the trench was compared by designing a special structure to simulate the real trench structure. From the experimental results, the low-k films in both sidewall and bottom of the new-designed trench structure shows a worse electrical performance and reliability after performing O2 plasma treatment. Moreover, the low-k films in the sidewall of the trench structure suffer a less damage in comparison to those samples in the bottom. Furthermore, as the width of the trench is scaled-down, the O2 plasma damage on the sidewall low-k films can be alleviated due to a reduced flux of oxygen active species. While the plasma damage on the bottom low-k films have no impact for trench width effect. Therefore, the scaled trench geometry would not cause more serious degradation for the low-k films under O2 plasma treatment with an identical treatment condition. The blanket film can be used to monitor the plasma damage for the next technology generation since the bottom low-k films have the worse impact under plasma treatment. Furthermore, this new-designed trench structure can easily analyses the low-k material degradation in the sidewall of the trench structure.