Voltammetric and Electrochemical Impedance Study of Sm3+ Effect onto the Nickel Electrodeposition Process

Tuesday, 7 October 2014
Expo Center, 1st Floor, Center and Right Foyers (Moon Palace Resort)
Y. Meas, J. R. López, P. F. Méndez, J. J. Perez, G. Trejo, R. Ortega (Centro de Investigación y DesarrolloTecnológico en Electroquímica (CIDETEQ)), and G. Stremsdoerfer (Ecole Centrale of Lyon, Tribological & Dynamical Systems Laboratory)
In this work, cyclic voltammetry and electrochemical impedance techniques were used to study the effect of Sm+3 dissolved in the electrolytic bath, on nickel reduction process. The results obtained by cyclic voltammetry showed that, during nickel electroplating without Sm+3, three reduction processes were observed and they may be related to the adsorption and/or reduction of H2, H3BO3 and Ni+2. On the other hand in presence of samarium, the Ni electroplating process is clearly affected; an additional reduction process and overpotential for Ni reduction can be observed. With the purpose of elucidating the processes attributed to the electroactive species of Sm+3,cyclic voltammetry studies were carried out employing a solution of sulfamic acid + samarium. These results shows the presence of a reduction process in a potential window of -0.77 to -0.82 V vs. SCE and the corresponding oxidation process (-0.54 to -0.57 V vs. SCE), indicating the presence of the redox couple Sm+3/Sm+2. Finally, the results obtained by electrochemical impedance technique indicate that during the electrodeposition of Ni, in the presence of samarium, resistance to charge transfer increases considerably. This increase can be attributed to the formation of a film of oxide or hydroxide of samarium.