The Path from Invention to Product: Poster Session

Tuesday, 7 October 2014: 18:00-20:00
Expo Center, 1st Floor, Center and Right Foyers (Moon Palace Resort)
Chairs:
John N. Harb and Gerardine G. Botte
879
Acceleration of Electroless Silver Deposition from Solutions Containing Cobalt(II) as Reducing Agent
A. Jagminiene, L. Tamasauskaite-Tamasiunaite, and E. Norkus (Center for Physical Sciences and Technology)
880
Voltammetric and Electrochemical Impedance Study of Sm3+ Effect onto the Nickel Electrodeposition Process
Y. Meas, J. R. López, P. F. Méndez, J. J. Perez, G. Trejo, R. Ortega (Centro de Investigación y DesarrolloTecnológico en Electroquímica (CIDETEQ)), and G. Stremsdoerfer (Ecole Centrale of Lyon, Tribological & Dynamical Systems Laboratory)
881
Electroless Co-B Deposition Using Dimethylamine Borane as Reducing Agent in the Presence of Different Amines
I. Stankevičienė, A. Jagminiene, L. Tamasauskaite-Tamasiunaite, and E. Norkus (Center for Physical Sciences and Technology)
882
Influence of Temperature on Electroless Copper Deposition from Formaldehyde-Containing Solutions Using 2-Hydroxy-1,2,3-Propanetricarboxylic Acid As Cu(II) Ligand
V. Kepeniene (Center for Physical Sciences and Technology), R. Stagniunaite (Lithuanian University of Educational Sciences), I. Stalnioniene, and E. Norkus (Center for Physical Sciences and Technology)
883
Via Superfill with Time Pulse Plating in a Dual Couple Redox System
S. Nad, Y. Sun (Substrate Packaging Technology Development, Intel Corporation), R. Chalupa (Design and Technology Services, Intel Corporation), C. Pendyala, and K. Ganesan (Substrate Packaging Technology Development, Intel Corporation)
884
Toward Industrialization on Semiconductor-Based Biosensors in Health and Medical Fields
S. Hideshima, S. Kuroiwa, T. Nakanishi, M. Hashimoto, Y. Mori (Institute for Nanoscience & Nanotechnology, Waseda University), and T. Osaka (Institute for Nanoscience & Nanotechnology, Waseda University, Faculty of Science and Engineering, Waseda University)