Surfactant Templated Growth of Films and Particles

Tuesday, 26 May 2015: 14:00-18:00
PDR 4 (Hilton Chicago)
Chairs:
Rohan Akolkar , Ji-Guang Zhang and Qiang Huang
14:00
1169
Surfactant-Templated Nanoporous Metal Films and Powders
D. B. Robinson, P. J. Cappillino, C. G. Jones, M. A. Hekmaty, M. S. Kent, B. W. Jacobs (Sandia National Laboratories), R. Hjelm (Los Alamos National Laboratory), L. R. Parent, and I. Arslan (Pacific Northwest National Laboratory)
14:20
1170
Impact of Thiourea Addition on Morphological and Structural Characteristics of Electrodeposited ZnO Thin Films Using Nitrate Aqueous Solutions
S. Gallanti, E. Chassaing, D. Lincot, and N. Naghavi (IRDEP)
14:40
1171
Template-Morphology Dependent Deposition of Ferromagnetic Metals
K. Rumpf, P. Granitzer (Karl Franzens University Graz), P. Poelt (University of Technology Graz), and H. Michor (Vienna University of Technology)
15:00
1172
In Situ Ftirs Study of Glycine Effects on Cobalt Electrodeposition on Gold Electrodes
R. A. J. Critelli, P. C. Isolani, and P. T. A. Sumodjo (Instituto de Química - Universidade de São Paulo)
15:20
1173
Control of the Magnetism of Iron Oxide Nanoparticles By Growth Parameters within Nanostructured Silicon
P. Granitzer, K. Rumpf (Karl Franzens University Graz), P. Poelt (University of Technology Graz), and M. Reissner (Vienna University of Technology)
15:40
1174
Improving Dispersion Plating of Nickel in Chloroaluminate Ionic Liquids
J. J. Coleman (Sandia National Laboratories), C. A. Apblett (Sandia National Labs), and P. Atanassov (University of New Mexico)
16:00
Intermission
16:20
1175
Orientation Control of Zeolite Films Using in Situ Electrochemical Method in Ionic Liquids
T. Yu, R. Cai, W. Chu, Y. Liu, and W. Yang (Dalian Institute of Chemical Physics, CAS)
 
1176
Effect of Plating Additives on Microstructure and Properties of Electrodeposited Ni-Fe Alloy Thin Film (Cancelled)
17:00
1177
Study on Thermal Stability of Ag-Coated Cu Powders Fabricated By Electrochemical Methods
N. Seo, K. Zhuo, Y. S. Park (Sungkyunkwan University), J. H. Park, Y. S. Roh (Farad Materials Corportaion), and C. H. Chung (Sungkyunkwan University)
 
1178
Using Azo As a Conductive and Adhesive Liner for through Glass Vias Filling By Cu Electroplating (Cancelled)
17:40
1179
Preparation of Surfaces of Germanium and Kovar Substrates by Electroplating Prior to Soldering
Y. Cetin (Middle East Technical University, Turkish Atomic Energy Authority), I. Karakaya (Middle East Technical University), G. Demirci (Aselsan Inc.), M. Erdogan, and M. S. Aras (Middle East Technical University)
See more of: E02: Surfactant and Additive Effects on Thin Film Deposition, Dissolution, and Particle Growth
See more of: Electrochemical/Electroless Deposition
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