Wet Metallization II

Monday, 25 May 2015: 10:00-14:00
PDR 5 (Hilton Chicago)
Chairs:
Paula Cojocaru , Yosi Shacham-Diamand and Giovanni Zangari
10:00
1136
(Invited) One-Dimensional Ammonium Nickel Phosphate Nanorods for the Fabrication of High-Performance and Flexible Symmetric Pseudocapacitors
K. I. Ozoemena (Council for Scientific and Industrial Research (CSIR)) and K. Raju (CSIR Pretoria, SA)
 
1137
Direct Copper Electroplating on Polyimide Film By Using Ni As Barrier and Conductive Interlayer (Cancelled)
11:00
1138
Rapid Prototyping of Multi-Scale Electrodes on Polymer Surfaces
C. Gabardo (McMaster) and L. Soleymani (McMaster University)
11:20
1139
SAM Assisted Nickel-Boron Electroless Metallization of PDMS
A. Molazemhosseini, S. Ieffa, P. Vena, and L. Magagnin (Politecnico di Milano)
11:40
1140
Fabrication of Mechanically-Robust Cu Films on Flexible Substrates Using Electron Beam Irradiation
I. S. Choi (Korea Institute of Science and Technology), Y. C. Joo (Seoul National University), S. Y. Lee (Seoul National Univerisity), and J. H. Lee (Seoul National University)
12:00
Intermission
See more of: E01: Metallization of Flexible Electronics
See more of: Electrochemical/Electroless Deposition
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