Wet Metallization I

Monday, 25 May 2015: 08:00-10:00
PDR 5 (Hilton Chicago)
Chairs:
Luca Magagnin , Takayuki Homma and Giovanni Zangari
08:00
Welcoming Remarks
08:10
Introductory Remarks
08:20
1133
(Invited) A Wet Process of Copper Wiring on Surface Modified Polyimide Film By Aminosilanes
T. Osaka, T. Yokoshima (Faculty of Science and Engineering, Waseda University), H. Kagawa (Grad. Sch. Adv. Sci. & Eng., Waseda University), T. Hachisu, and A. Sugiyama (Inst. Nanoscience & Nanotechnology, Waseda University)
09:00
1134
Polymer Supported and Freestanding Transparent Electrodes Produced By Ink-Jet Printing and Electrodeposition
A. V. Oriani, M. A. Spreafico (Politecnico di Milano), P. Cojocaru, A. Marrani, F. Triulzi, M. Apostolo (Solvay Specialty Polymers), and L. Magagnin (Politecnico di Milano)
09:20
1135
Gold Nanoparticle Metallization of Flexible Conducting Polymer Electrode
R. Ofek Almog (Azrieli College of Engineering Jerusalem, Tel Aviv University), R. Pandey, Y. Sverdlov, and Y. Shacham-Diamand (Tel Aviv University)
09:40
Break
See more of: E01: Metallization of Flexible Electronics
See more of: Electrochemical/Electroless Deposition
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