Specimen Preparation Method to Dual-Axis TEM Analysis Technique
1. Making a Planar lamella by FIB
2. Observing a PTEM specimen with TEM
(Precaution : zone axis should be adjusted exactly)
3. Making a cross-section lamella by FIB
(Precaution : Protection layer should be deposited on both sides)
4. Observing a XTEM specimen with TEM
We propose DAT method to improve the problem of artifact in de-processing step. The TEM result with DAT method is shown in figure 4. We can know the exact location of failure with observing a PTEM sample. We can know the cause of failure with observing a XTEM sample. Moreover, we can analysis the chemical and physical information through DAT method. This method is very effective and has a high success rate in analysis.
 A.E.M. De Veirman, “3-Dimensional’ TEM silicon-device analysis by combining plan-view and FIB sample preparation”, Materials Science and Engineering: B, 102(1-3), pp. 63-69, 2003.
 Jon C. Lee, David Su, J.H. Chuang, “A Novel Application of the FIB Lift-out Technique for 3-D TEM Analysis”, Microelectronics Reliability Asset, 41(9-11), pp. 1551-1556, 2001.