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A Multiscale Approach Toward the Design and Understanding of Stable and Conductive Anion Exchange Membrane Materials
In this talk we will highlight our collaborative, simulation-focused efforts to develop and understand high performance AEM materials for electrochemical applications. Among other things, we will discuss our efforts to develop, validate, and apply simulation methodologies that can provide new and fundamental insights into the nature of the membrane(s) cationic stability, anionic conductivity, and the uncertainty in our respective models that range from atomistic to continuum scales. These multiscale modeling approaches include everything from atomistic MD simulations using reactive (ReaxFF) and polarizable force fields, to coarse-grained molecular dynamics simulations with developed using uncertainty quantification (UQ) based methodologies and continuum level modeling approaches.
For our initial efforts that we will discuss in this talk, we utilize relatively simple backbone materials such as Poly(2,6-dimethyl-1,4-phenylene oxide) (PPO). These backbone materials are effectively used as a model material system. This enables us to develop and validate simulation methods that can predict and resolve the proper structure-property relationships; a key step before moving to more complex materials. Further, the simpler PPO-type backbone materials provide a key advantage at this stage in that they can concurrently be (i) processed, synthesized, and characterized in our labs, and (ii) subjected to unique processing methods/conditions that includes both casting and electro-spinning processes.
This last capability is salient because the focus of the model and simulation development efforts are on the application to multi-scale systems. The ability to concurrently process the materials using different methods (i.e., cast, electro-spun, and co-spun with an inert matrix material) and under different conditions can drastically influence the material’s morphologies, structures, ordering, and properties.
Acknowledgments:
KNG, JPM, and DC gratefully acknowledge the support of the U.S. Department of the Army, Army Materiel Command, and U.S. Army Research Development and Engineering Command. This work was completed, in part, through the U.S. Army Research Laboratory’s Enterprise for the Multiscale Research of Materials (EMRM). This work was completed in conjunction with an Army Research Laboratory EMRM’s Multiscale Modeling of Electronic Materials (MSME) Collaborative Research Alliance (CRA). VM, LCJ, JL, DB, JBH, ZL, AvD, WZ, and RMK gratefully acknowledge the financial support of the MSME CRA.
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