Also, the memcapacitance can modulate the drain current in MOSFETs and TFTs as variable gate stack capacitor, named memcapacitor, which gives the functions of memory, logic, neuromorphic operation, and so on. In this presentation, we discuss the memcapacitive characteristics in metal-oxide-semiconductor (MOS) capacitor structure consisting of reactive electrode (Mo, Al) and hafnium oxide (HfOX) on n-type Si and indium-gallium-zinc-oxide (IGZO) semiconductor substrates. The capacitance-voltage curves exhibited sequentially changing capacitance as repeating the voltage sweeps. The saturation capacitance was decreased as repeating +V application, while the depletion capacitance was barely changed as –V application. Also, the capacitance-time curves disclosed the same tendency of capacitance change. On the other hand, the MOS structure with inert electrode (Pt) did not show the capacitance change. These memcapacitive behaviors were induced by the migration of oxygen ions between reactive electrodes (Mo, Al) and HfOX, which modulated the permittivity and effective capacitor area. These results demonstrated the memcapacitive characteristics in MOS structure through voltage-driven oxygen migration for the application to memory, logic, and neuromorphic devices.
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