At present, the light-emitting-diode (LED) has been a tremendous surge in its application as a new type of generation lighting source. The thermal performance and structural reliability of LED system have been investigated by different conditions in electronic package [1]. With the minimization of the LED packaging, the reliability problem, especially, the thermal reliability becomes more and more seriously. Hence the heat dissipation for LED system becomes much crucial. Lots of heat management methods have been investigated for LED system designing and manufacturing. The most popular cooling method used in the LED system is the passive cooling, however, its cooling efficiency is very low. It is very significant to develop the heat dissipation method [2, 3].

A systematic numerical and experimental method is developed to optimize a caution lamp with multichips LEDs in this paper. Here we intend to describe the thermal performance of LED caution lamp with multiple LED chips through the structural optimization by the finite element method. And to understand the thermal characteristics of the caution lamp with difference structural parameters. After the optimization, one type of caution lamp was made and the highest temperatures of LED chips have been test. This optimization method is useful for design and manufacturing of caution lamps with multiple LED chips.

After numerical simulation, we prepared the caution lamp sample with six LED chips according to the results. The Thermalcouples are used to test the temperature of the lamp. Compared with the simulation and the experiment data, the high temperature of LEDs were reduced by choosing fitting parameters. It indicates that the results and methods used in this paper can provide the guidance in the understanding of thermal management for LED lamps design.

Figure 1 show temperature distribution of light structures before and after thermal-structural optimization.

Figure 2 show the test principle connection and test system.