Initial results are presented in Fig. 1. Structures with aspect ratios (height/diameter) lower than 1 feature more shrinkage in height than in diameter. The top surface area in this case is much higher than the lateral surface area, resulting in more degassing through the top surface of the post. As the aspect ratio increases beyond 1, the values for shrinkage in height and diameter start to be common. In other words, shrinkage tends to become isometric as the height of the posts increases for a given diameter. Shrinkage does not seem to be dependent on temperature after 800°C, as also observed in previous works2. However, the shrinkage observed when using a vacuum atmosphere is higher than in the case of nitrogen as seen from Fig.2.
These results reinforce our hypothesis that the shrinkage is dependent on the surface available for degassing, or the ratio of lateral to top surface area. A faster rate of degassing through the lateral area results in higher lateral shrinkage and same is true for the top surface. The choice of atmosphere is likely to play a role on determining the speed of diffusion of the species being generated during pyrolysis.
Ongoing work is 1) exploring the shrinkage of different geometries featuring the same surface area as those explored here; 2) relating this shrinkage to the ratio of volume/surface area for different structures across different length scales; and 3) quantifying the rate of shrinkage based on the byproducts of carbonization at different temperatures. The ultimate goal is developing a mathematical model to explain the shrinkage phenomena and incorporate it as a tool in the design of carbon MEMS structures.
References:
1. R. Martinez-duarte and M. J. Madou, in Microfluidics and Nanofluidics Handbook: Fabrication, Implementation and Application, S. Chakraborty and S. Mitra, Editors, p. 231–268, CRC Press (2011).
2. B. Y. Park, L. Taherabadi, C. Wang, J. Zoval, and M. J. Madou, J. Electrochem. Soc., 152, J136 (2005).
3. L. Amato et al., Carbon N. Y., 94, 792–803 (2015) http://linkinghub.elsevier.com/retrieve/pii/S0008622315005291.