On-Chip energy storage is currently on high demand as its potentiality for compatible integration with flexible and miniaturized functional electronic devices. Conventional microfabrication has been the widely employed technique in fabricating interdigitated microsupercapacitor devices in a reliable manner. However, developing unconventional lithography techniques can be attractive interms of simplicity with minimal sophistication while not compromising the performance. Here, we propose a simple and versatile strategy to fabricate on-chip microsupercapacitors (MSCs) employing hand-written sacrificial marker ink patterns, both in lift-off and etching modes. As a prototype, this technique is demonstrated for the fabrication of conducting polymer MSCs involving poly(3,4-ethylenedioxythiophene), polyaniline and metal oxide electrode materials. Typical values of energy density in the range of 5-11 mWh/cm³ at power densities of 1-6 W/cm³ are achieved, that are comparable to thin film batteries and superior to the carbon and metal oxide based microsupercapacitors reported in the literature. Fabrication of microsupercapacitor devices on curved surfaces and multi-stack designs are additional assets of this technique. This innovative strategy may be broadened for scalable fabrication of a wide variety of on-chip energy storage devices.