Deposition Methods

Wednesday, 1 June 2016: 13:20-16:50
Aqua 307 (Hilton San Diego Bayfront)
Chair:
Christian L. Arrington
13:20
1107
(Invited) Progress on Electroless Atomic Layer Deposition
J. L. Stickney, D. M. Benson, and K. Jagannathan (The University of Georgia)
13:50
1108
Composition Control of Cu2ZnSnS4 Thin Films in Electrodeposition
A. Tang, F. Wang (Beijing University of Chemical Technology), and Z. Li (Beijing University of Chemical Techonology)
14:10
1109
Electroless Deposition of Platinum Using Multivalent Metal Ions As Reducing Agents
E. Norkus, A. Jagminiene, I. Stankeviciene, L. Tamasauskaite-Tamasiunaite (Center for Physical Sciences and Technology), A. Joi (Lam Research Corporation), Y. Dordi (Corporate Technology Development, Lam Research), V. Buzas, L. Maciulis (NanoAvionics, JSC), and L. Tumonis (Center for Physical Sciences and Technology)
14:30
1110
Magnetic Field and Substrate Effects on the Electrodeposition of High Magnetostrictive Cofe Films
J. R. Pillars, E. D. Langlois, C. L. Arrington, and T. Monson (Sandia National Laboratories)
14:50
Break
15:10
1111
First-Principle Theory to Understand Autocatalysis in Electroless Cu Deposition
M. Zhao, R. Akolkar, and A. B. Anderson (Case Western Reserve University)
15:30
1112
Area-Selective Electroless Deposition of Gold Nanostructures with Various Morphologies on Silicon Assisted By Focused Ion Beam Irradiation
H. Itasaka, M. Nishi, M. Shimizu, and K. Hirao (Kyoto University)
15:50
1113
Morphology and Electrical Properties of Copper Thin Films Electroplated on Ni/n+-Si(100) for Silicon Solar Contact
M. Mebarki, A. Moussi (CRTSE, 2, Bd Frantz Fanon, BP 140-Alger, 7-M, Algérie), A. Azizi, M. R. Khelladi (L.C.I.M.N, Université Ferhat Abbas, Sétif 19000, Algeria), and L. Mahiou (CRTSE, 2, Bd Frantz Fanon, BP 140-Alger, 7-M, Algérie)
16:10
1114
Investigation on Process Parameters on the Adhesion of Electroless Ni-P Film on Silane Compound Modified Si Wafer
C. W. Hsu, W. Y. Wang (National Tsing-Hua University), and T. C. Wei (National Tsing Hua University)
16:30
1115
Effect of Different Solvents on Aminosilane-Compound Modification and Its Influence on the Adhesion Between Electroless Nickel/Phosphorous Film and Silicon Wafer
W. Y. Wang, C. W. Hsu (National Tsing-Hua University), and T. C. Wei (National Tsing Hua University)
See more of: E02: Three-Dimensional Electrodeposition and Electroless Deposition
See more of: Electrochemical/Electroless Deposition
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