CMP Control Systems

Wednesday, 1 June 2016: 13:10-16:00
Sapphire 411 B (Hilton San Diego Bayfront)
Chair:
G. Bahar Basim
13:10
1036
Advanced Process Control for Variability Control in Chemical Mechanical Polishing Process
D. R. Koli (GLOBALFOUNDRIES Inc), R. Wan Hsiang Liang (Globalfoundries), H. J. Kim (GLOBALFOUNDRIES), and R. Solan (Globalfoundries)
 
1037
A Novel Light Scattering Analysis Method for Monitoring Undiluted CMP Slurry (Cancelled)
 
1038
Mixed Strategy Combination of Pressure and Velocity Control for Chemical Mechanical Planarization of Patterned Wafers (Cancelled)
 
1039
Bubble Tolerant Liquid Management (Cancelled)
14:30
Afternoon Break
14:50
1040
Advanced Carriers on Legacy CMP Tools - an Intelligent Solution for Flexible Production Environments and R&D Labs
M. Franz, I. Schubert, R. Junghans, R. Martinka (Fraunhofer ENAS), C. Rudolph, H. Wachsmuth (Fraunhofer IZM-ASSID), D. Trojan, B. VanDevender, P. Wrschka (Axus Technology), and K. C. Gottfried (Fraunhofer ENAS)
 
1041
Immersion Metrology for CMP Pad Monitoring (Cancelled)
15:30
Open Discussion of CMP Technology
See more of: D02: Chemical Mechanical Polishing 14
See more of: Dielectric Science and Materials
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