Heat dissipation problem is becoming a crucial barrier in the continuous process of electronic devices and systems miniaturization. Thermal management of devices and systems directly determines their efficiency and life time. In recent years, the rise of mobile device and touch screen applications has driven new research and development efforts into materials compatible with transparent and flexible design requirements. Existing research to develop thermally conductive polymer composite are based on traditional fillers (metal/ceramic/carbon) and matrix system which requires high loading of fillers and in turn suffers with various fabrication and property issues. In this talk, a new approach of engineering thermal transport channels via intermolecular interaction will be introduced. Thermal conductivity enhancement of around 2-3 times the neat polymer can be achieved without using any traditional fillers. The critical factor responsible for thermal conductivity enhancement was found to be the “thermal bridges” formed by hydrogen bonding between molecular species. These thermal bridges lead to the formation of continuous thermal highways for the efficient phonon transport. This talk presents a unique approach to engineer material interaction at molecular level and achieves macro-scale function as desired.