Recent progress in the development of the flexible and stretchable systems with various materials strategies establishes a fundamental basis for a high-performance electronics on the soft and ultrathin bendable elastomeric deformable substrates. The resulting enabled type of functionality cannot be reproduced using conventional wafer-based technologies. These types of electronics on the unusual soft substrates relies on the techniques of either top-down approaches or bottom-up approaches. These approaches allow assemblies of ultra-thin electronics onto various curvilinear shapes, with linear elastic mechanical responses to large strain deformations. However, such electronic devices fabricated using these techniques suffers from the poor device performances compared to that of the conventional rigid substrate based electronics. Here, we report a new technology in flexible electronics based on a new fabrication technique called, “Fully Formed Reverse Device Fabrication.” The key fabrication strategies and examples of various device characteristic allow integration of high-performance electronics with ultra-thin flexible substrates.