1620
CO2 Electrochemical Reduction to Formate on Cu@Sn by Electrodeposition

Wednesday, 16 May 2018
Ballroom 6ABC (Washington State Convention Center)

ABSTRACT WITHDRAWN

In recent years, the emissions of carbon dioxide (CO2) into atmosphere caused by industrial production has been considered to be one of the main causes of global warming, which has recently attracted much attention1. Electrochemical reduction of CO2 could provide an attractive solution to this climate issue with CO2 converted into useful fuels such as formic acid, methane, methanol, ethylene, etc., which represents a value-added path that can simultaneously produce alternative fuels and remedy the carbon emissions generated by conventional fuels2. Metal catalysts have been demonstrated effectively and widely used materials to obtain formate by reducing CO2. Among these metals, tin or copper-tin alloys are excellent candidates regarding to CO2 electroreduction to produce formate fuel. However, the fabrication production of catalysts is complicated for practical application, as the synthetic process need high-temperature calefaction or the addition of expensive additives3.

Electrodeposition with hydrogen bubble template in aqueous solution is a facile, low-energy method, which can easily create a 3D structure so that can provide large specific surface area on the substrate. Meanwhile, the porous foam attributed to concurrent hydrogen bubbles with different deposition time has a distinct impact on the catalytic activity and selectivity during CO2 electrochemical reduction. By applying electrodeposition methods, we have successfully synthesized the Sn@Cu catalysts, which was controlled by simply adjusting the electrodeposition time. As demonstrated by both CV and LSV results, highly selective HCOO- production (Faradaic efficiency = 86.7%) can be realized at a potential of -1.6 V vs. SCE with really high current density greater than 10 mA cm-2.

References

[1]. J.L. Qiao; M.Y. Fan; Y.S. Fu; Z. Bai; C. Ma; Y. Liu; X.D. Zhou, Electrochim. Acta, 153, 559 (2015)

[2]. Y. Wang; J. Zhou; W. Lv; H. Fang; W. Wang, Appl. Surf. Sci., 362, 394 (2016)

[3]. X. Zhang; T. Lei; Y.Y. Liu; J.L. Qiao, Appl. Catal., B, 218, 46(2017)