Electrodeposition of coatings is an effective way to form a protective layer on metal surfaces of complex shape. The uniformity of the deposit is a function of the current distribution, and depends on the induction time (time prior to “initiation” of deposition), the local deposition rate and the resistivity of the film that is formed. In cathodic electrodeposition, hydrogen gas evolves on the deposition surface, leading to an increase in the local pH. The change in pH reduces the solubility of the positively charged resin-containing micelles and causes a coating to form on the surface. The induction time, which is a key factor in the prediction of film thickness, has been attributed to the time that is required to increase the local pH to about 12 [1, 2]. The deposition rate, which is initially low, changes significantly during the induction period and eventually increases to a steady value that is proportional to the charge passed. An increased fundamental understanding is needed to improve our ability to accurately model E-coat systems in order to optimize performance. The purpose of this study is to develop a detailed understanding of the initial stages of deposit growth. Of particular interest are the changes that take place during the induction time. Experiments designed to elucidate the role of pH change clearly show that the local change in pH alone is not responsible for the induction time. This observation was further supported by additional experiments where the induction time at a specified current was observed to vary with the type of substrate used for deposition. Consequently, scanning electron microscopy was used to study the morphology of the initial deposit on different substrate surfaces including bare steel, galvanized steel, and phosphated steel. It was found that the initial film tends to form preferentially on defects and scratches in the metals. This observation was validated by experiments with intentionally scratched surfaces. The initial film also appeared to form around gas bubbles that were present on the substrate surface. The mechanism for preferred deposition at defects and bubbles is currently under investigation. As part of this effort, deposition on “defect free” surfaces has been performed. Microscopic images are used to track deposit formation as a function of time during the initial stages of deposition before formation of a highly resistive film. The rate of deposition increases with time, which may be connected to an increase in the local current density in the deposit free areas. The additional insight provided by this study will provide the basis for an improved model of the early stages of E-coat deposition. This model will then be incorporated into a large-scale simulation tool to enable improved process prediction and optimization.

Acknowledgment

The authors gratefully acknowledge funding from the Ford Motor Company under their University Research Program (URP).

References

1. Miskovic-Stankovic, V.B. and M.D. Maksimovic, The effect of concentration on the cathodic electrodeposition process. Process in Organic Coating, 1988. 16: p. 255-263.
2. Pierce, P.E., The physical chemistry of the cathodic electrodeposition process. Journal of Coatings Technology and Research, 1981. 53: p. 52.