Tuesday, 15 May 2018: 18:00-20:00
Ballroom 6ABC (Washington State Convention Center)
Structure Stability of Electrodeposited Au-Cu Alloy Micro-Cantilever Evaluated By Long-Term Vibration Test for Applications As Movable Components in MEMS Devices
K. Nitta (Tokyo Insititute of Technology, CREST, JST), K. Tachibana, H. Tang (Tokyo Institute of Technology, CREST, JST), C. Y. Chen, T. F. M. Chang, D. Yamane (CREST, JST, Tokyo Institute of Technology), T. Konishi (NTT Advanced Technology Corporation, CREST, JST), K. Machida (Tokyo Institute of Technology, CREST, JST), K. Masu, and M. Sone (CREST, JST, Tokyo Institute of Technology)
