The memory and logic chips are essential for the expansion of big data processing and AI related technologies in the near futrure.

The needs for high density cell and high aspect ratio cell structure and even EUV patterning for the next generation memory and logic chips are increasing more and more.

The conventional etching technologies cannot porvide the appropriate solutions for the next generation nano chip fabrication anymore.

I researched some innovative new etching technologies recently.

- ultra low pressure plasma ( < 1mTorr)

- ultra low temperature ESC ( < -100 degree)

- ultra low radical plasma (Ion beam etch)

The above new technologies will give the breakthrough against current process limitations on the nano chip fabrication.