G03 - Emerging Technologies & Processes 2

Wednesday, 16 October 2019: 13:30-15:30
Room 211 (The Hilton Atlanta)
Chairs:
Cor Claeys and Simon Deleonibus
13:30
(Invited) Challenges of Graphene Process Integration in CMOS Technology
M. Lisker, M. Lukosius, R. Lukose, C. Wenger, and A. Mai (IHP-Leibniz-Institut für innovative Mikroelektronik)
14:00
(Invited) Optimized HfO2-Based Mim Module Fabrication for Emerging Memory Applications
M. Kalishettyhalli Mahadevaiah, M. Lisker, M. Fraschke, S. Marschmeyer, D. Schmidt, C. Wenger, E. Perez, and A. Mai (IHP-Leibniz-Institut für innovative Mikroelektronik)
14:30
(Invited) Micro-Transfer Printing Technology for GaN Transistors
D. J. Meyer, B. P. Downey (U.S. Naval Research Laboratory), A. Xie (Qorvo, Inc.), D. S. Katzer, S. C. Mack, N. Nepal (U.S. Naval Research Laboratory), Y. Cao (Qorvo, Inc.), R. L. Coffie (RLC Solutions), M. T. Hardy (U.S. Naval Research Laboratory), E. Beam, and C. Lee (Qorvo, Inc.)
15:00
(Invited) Hybrid Monolithic Nanomanufacturing of 3D Liquid-Solid Heterojunction Devices for Self-Powered Smart Skin
W. Wu (Purdue University)
See more of: G03: Semiconductor Process Integration 11
See more of: Electronic Materials and Processing
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