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Canceled Presentations
Electronic Materials and Processing
Monday, 14 October 2019
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08:00-09:40
G05: Oxide Memristors 2
G05 - Memristive Properties of Complex Oxides
Room 210
Chair(s):
Stephen S. Nonnenmann
08:00-11:00
G03: Semiconductor Process Integration 11
G03 - Materials and Characterizations
Room 211
Chair(s):
Junichi Murota and Cor Claeys
08:35-09:20
G02: Atomic Layer Deposition Applications 15
G02 - Tutorial on ALD for Lithium-Ion Battery Applications
Room 214
Chair(s):
Fred Roozeboom and Chanyuan Liu
09:20-11:00
G02: Atomic Layer Deposition Applications 15
G02 - Battery Applications
Room 214
Chair(s):
Chanyuan Liu and Mark D. Losego
10:00-10:20
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - Introductory Remarks
Room 209
Chair(s):
Jerzy Ruzyllo
10:00-12:40
G05: Oxide Memristors 2
G05 - Resistive Switching in Binary Oxide Systems
Room 210
Chair(s):
Stephen S. Nonnenmann
10:20-12:00
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - FEOL Cleaning
Room 209
Chair(s):
Paul W. Mertens and Yusuke Oniki
11:00-11:40
G02: Atomic Layer Deposition Applications 15
G02 - Medical Applications
Room 214
Chair(s):
Ganesh Sundaram and Jolien Dendooven
11:00-12:50
G03: Semiconductor Process Integration 11
G03 - Emerging Material Growth
Room 211
Chair(s):
Meng Tao and Seiichi Miyazaki
11:40-12:40
G02: Atomic Layer Deposition Applications 15
G02 - Nano and Flexible Electronics I
Room 214
Chair(s):
Oscar van der Straten and Christophe Vallée
14:00-14:20
G02: Atomic Layer Deposition Applications 15
G02 - Nano and Flexible Electronics II
Room 214
Chair(s):
Oscar van der Straten and Christophe Vallée
14:00-15:30
G03: Semiconductor Process Integration 11
G03 - Advanced Post CMOS Devices and Processes
Room 211
Chair(s):
Eddy Roger Simoen and Oussama Moutanabbir
14:00-15:40
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - Ge, SiGe, or III-V Surface
Room 209
Chair(s):
Anthony J. Muscat and Sangwoo Lim
G05: Oxide Memristors 2
G05 - Electrical and Optical Characterization of Memristors
Room 210
Chair(s):
A. Alec Talin
14:20-15:40
G02: Atomic Layer Deposition Applications 15
G02 - Hybrid Materials
Room 214
Chair(s):
Ganesh Sundaram and Anil U. Mane
15:45-16:00
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - Short Introduction for Poster Presentation
Room 209
Chair(s):
Koichiro Saga
16:00-17:40
G05: Oxide Memristors 2
G05 - Advances in Artificial Neural Networks
Room 210
Chair(s):
Juan C. Nino
18:00-20:00
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 Poster Session
Grand Ballroom
G05: Oxide Memristors 2
G05 Poster Session
Grand Ballroom
Tuesday, 15 October 2019
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08:00-09:40
G03: Semiconductor Process Integration 11
G03 - Wide-Gap Semiconductor Devices and Processes 1
Room 211
Chair(s):
Yu Cao and Cor Claeys
08:20-09:00
G02: Atomic Layer Deposition Applications 15
G02 - Tutorial on Atomic Layer Processing for Advanced Electronics
Room 214
Chair(s):
Andrea Illiberi and Fred Roozeboom
08:20-09:40
G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
G06 - 3D Trends
Room 210
Chair(s):
Wei-Ping Dow and Yasuhiko Takeno
08:30-10:30
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - Wetting and Drying
Room 209
Chair(s):
Derek Bassett and Yasutaka Yamaguchi
09:00-12:40
G02: Atomic Layer Deposition Applications 15
G02 - Area Selective Deposition and Atomic Layer Etching I
Room 214
Chair(s):
Andrea Illiberi, Jeffrey W. Elam and Chip Eddy
10:00-12:00
G03: Semiconductor Process Integration 11
G03 - Wide-Gap Semiconductor Devices and Processes 2
Room 211
Chair(s):
Yu Cao and Keisuke Shinohara
G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
G06 - Copper Electrodeposition
Room 210
Chair(s):
Kazuo Kondo and Wei-Ping Dow
10:50-12:30
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - Wet Etching
Room 209
Chair(s):
Sangwoo Lim and Derek Bassett
13:30-15:40
G03: Semiconductor Process Integration 11
G03 - Thin Film Devices and Processes
Room 211
Chair(s):
Junichi Murota and James Sturm
14:00-15:00
G02: Atomic Layer Deposition Applications 15
G02 - Area Selective Deposition and Atomic Layer Etching II
Room 214
Chair(s):
Chanyuan Liu and Byungha Shin
14:00-15:40
G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
G06 - PCB Processes
Room 210
Chair(s):
Muneharu Kondo and Rohan Akolkar
14:00-16:00
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - Particle Removal
Room 209
Chair(s):
Jin-Goo Park and Toshiyuki Sanada
15:00-17:20
G02: Atomic Layer Deposition Applications 15
G02 - Solar Energy Conversion: Photovoltaics and Photoelectrochemistry
Room 214
Chair(s):
Jolien Dendooven and Rong Chen
16:00-17:40
G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
G06 - High Density Interconnection
Room 210
Chair(s):
Muneharu Kondo and Kazuo Kondo
16:00-18:20
G03: Semiconductor Process Integration 11
G03 - Emerging Technologies & Processes 1
Room 211
Chair(s):
Meng Tao and Patrick Steglich
16:20-17:00
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - Contamination Control
Room 209
Chair(s):
Koichiro Saga
17:00-17:40
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - BEOL Cleaning
Room 209
Chair(s):
Jerzy Ruzyllo
17:50-18:00
G01: 16th International Symposium on Semiconductor Cleaning Science and Technology (SCST 16)
G01 - Concluding Remarks
Room 209
Chair(s):
Anthony J. Muscat
18:00-20:00
G02: Atomic Layer Deposition Applications 15
G02 Poster Session
Grand Ballroom
G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
G06 Poster Session
Grand Ballroom
Wednesday, 16 October 2019
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08:00-10:50
G03: Semiconductor Process Integration 11
G03 - Sensing Devices and Processes
Room 211
Chair(s):
Junichi Murota and Hiromu Ishii
08:00-12:40
G04: Thermoelectric and Thermal Interface Materials 5
G04 - Thermoelectric and Thermal Interface Materials 1
Room 209
Chair(s):
Colm O'Dwyer, Jr-Hau He, Kafil M. Razeeb and Walter van Schalkwijk
08:20-09:40
G02: Atomic Layer Deposition Applications 15
G02 - 2D Materials and Quantum Dots
Room 214
Chair(s):
Stefan De Gendt and Rob Ameloot
G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
G06 - Plating Additives
Room 210
Chair(s):
Lingyun Wei and Wei-Ping Dow
10:00-12:00
G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
G06 - 2.5 and 3D Packaging
Room 210
Chair(s):
Makoto Motoyoshi and Lingyun Wei
10:00-12:25
G02: Atomic Layer Deposition Applications 15
G02 - Advanced Processing and Characterization
Room 214
Chair(s):
Oscar van der Straten and Christophe Detavernier
10:50-11:50
G03: Semiconductor Process Integration 11
G03 - Electron-Emission/Memory Devices and Processes
Room 211
Chair(s):
Junichi Murota and Hiromu Ishii
13:30-15:30
G03: Semiconductor Process Integration 11
G03 - Emerging Technologies & Processes 2
Room 211
Chair(s):
Cor Claeys and Simon Deleonibus
14:00-18:00
G04: Thermoelectric and Thermal Interface Materials 5
G04 - Thermoelectric and Thermal Interface Materials 2
Room 209
Chair(s):
Colm O'Dwyer, Kafil M. Razeeb, Walter van Schalkwijk and Jr-Hau He
15:50-17:30
G03: Semiconductor Process Integration 11
G03 - Quantum Devices and Processes
Room 211
Chair(s):
Simon Deleonibus and Maud Vinet
18:00-20:00
G04: Thermoelectric and Thermal Interface Materials 5
G04 Poster Session
Grand Ballroom
Thursday, 17 October 2019
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08:00-12:40
G04: Thermoelectric and Thermal Interface Materials 5
G04 - Thermoelectric and Thermal Interface Materials 3
Room 209
Chair(s):
Jaeho Lee, Renkun Chen and Yue Wu
08:00-18:00
G04 - Thermoelectric and Thermal Interface Materials 5
Chair(s):
Jaeho Lee, Renkun Chen, Colm O'Dwyer, Yue Wu, Jr-Hau He, Walter van Schalkwijk and Kafil M. Razeeb
14:00-14:40
G04: Thermoelectric and Thermal Interface Materials 5
Amazon Catalyst at ECS Grant Winner Address
Room 209
14:40-17:20
G04: Thermoelectric and Thermal Interface Materials 5
G04 - Thermoelectric and Thermal Interface Materials 4
Room 209
Chair(s):
Renkun Chen, Yue Wu and Jaeho Lee
