G06 - Copper Electrodeposition

Tuesday, 15 October 2019: 10:00-12:00
Room 210 (The Hilton Atlanta)
Chairs:
Kazuo Kondo and Wei-Ping Dow
10:00
(Invited) Microfluidic Electroless Interconnection (MELI) Process for Low-Temperature, Pressureless Chip Stacking Applications
C. R. Kao, H. T. Hung (National Taiwan University), and Y. H. Chen (Unimicron Corp)
10:40
Controllable Single Crystal Copper Morphology on Copper Foil By Electrodeposition
W. P. Dow and L. J. Lin (National Chung Hsing University)
11:00
Enhancing Surface Flatness and Brightness of Zn/Cu Alloy By Acidic Electroplating Copper
W. P. Dow (National Chung Hsing University)
11:20
(Invited) Characteristics, Types and Development Direction of the Copper Foils for Batteries
Y. T. Kim, S. H. Jun, A. N. Lee, H. G. Kim, and S. H. Kim (KCFT)
See more of: G06: Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2
See more of: Electronic Materials and Processing
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