G06 Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2

Lead Organizer: Kazuo Kondo (Osaka Prefecture University)

Co-organizers: Fred Roozeboom (Eindhoven University of Technology, TNO-Holst Centre) , Gangadhara Mathad (Semiconductor Tech. Consulting) , Wei-Ping Dow (National Chung Hsing University) , Masanori Hayase (Tokyo University of Science) , Mitsumasa Koyanagi (Tohoku University) , Rohan Akolkar (Case Western Reserve University) , Yasuhiko Takeno (Global Net Corp.) , Lingyun Wei (The Dow Chemical Company) , Muneharu Kondo (Moses Lake Industries Inc) and Makoto Motoyoshi (Tohoku-MicroTec Co., Ltd)

Tuesday, 15 October 2019

08:20-09:40


G06 - 3D Trends
Room 210
Chair(s): Wei-Ping Dow and Yasuhiko Takeno

10:00-12:00


G06 - Copper Electrodeposition
Room 210
Chair(s): Kazuo Kondo and Wei-Ping Dow

14:00-15:40


G06 - PCB Processes
Room 210
Chair(s): Muneharu Kondo and Rohan Akolkar

16:00-17:40


G06 - High Density Interconnection
Room 210
Chair(s): Muneharu Kondo and Kazuo Kondo

18:00-20:00


G06 Poster Session
Grand Ballroom

Wednesday, 16 October 2019

08:20-09:40


G06 - Plating Additives
Room 210
Chair(s): Lingyun Wei and Wei-Ping Dow

10:00-12:00


G06 - 2.5 and 3D Packaging
Room 210
Chair(s): Makoto Motoyoshi and Lingyun Wei